Ultra Flat Silicon Wafers are key basic materials in semiconductor manufacturing. Through high-precision processing, silicon single crystals are cut into extremely thin wafers and finely polished to achieve extremely high surface flatness. The thickness of this wafer is usually at the micron level, and the surface flatness requirement is extremely high. It is mainly used in the manufacture of microelectronic devices and can meet the strict requirements of high-precision equipment for substrate materials. Ultra Flat Silicon Wafers are an indispensable core material for modern electronic manufacturing, and its quality directly determines the performance and reliability of the final product.

1. High flatness:

The flatness of Ultra Flat Silicon Wafers is one of its core advantages. The total thickness variation (TTV) is strictly controlled at ≤2μm (actually ≤1μm), far exceeding the industry standard. This high flatness ensures that the wafer surface can evenly accept material and pattern transfer in processes such as lithography and thin film deposition, thereby improving the performance and yield of microelectronic devices. Highly flat wafers can reduce process deviations and improve production efficiency, making them an ideal choice for manufacturing high-precision semiconductor devices.

2. Multiple diameter specifications:

Ultra Flat Silicon Wafers offers two diameter specifications, 4 inches and 6 inches, to meet the needs of different application scenarios. Whether it is small chip manufacturing or large-scale integrated circuit production, you can find the right size to choose from. This diverse specification design allows customers to flexibly choose according to their own process requirements, thereby optimizing production costs and efficiency. At the same time, standardized sizes are also compatible with existing production equipment, further improving the versatility of the product.

3. Rich doping types:

Ultra Flat Silicon Wafers provide a variety of doping types, including P-type/boron doping, N-type/phosphorus doping, N-type/arsenic doping, and floating zone method (FZ). The resistivity ranges from ≤0.005~40Ω·cm, which can meet the electrical performance requirements of different electronic devices. This diverse doping selection enables the wafer to adapt to the manufacturing needs of various semiconductor devices, from high-power devices to low-power sensors, and suitable material solutions can be found.

4. Low particle contamination:

The number of surface particles is controlled at ≤10ea@0.3μm, which is much lower than the industry average. In the microelectronics manufacturing process, particle contamination is one of the main causes of defects and reduced yield. By strictly controlling the number of particles, Ultra Flat Silicon Wafers can significantly reduce process problems caused by particle contamination, thereby improving the yield and reliability of the product. This is especially important for high-precision lithography and etching processes, ensuring the cleanliness of the wafer surface and the stability of the process.

5. High-quality surface treatment:

Ultra Flat Silicon Wafers adopts DSP (Double-Sided Polished) double-sided polishing process to ensure that both sides of the wafer have extremely high flatness and finish. This high-quality surface treatment process provides good surface conditions for subsequent processes such as lithography and thin film deposition. Double-sided polishing not only improves the flatness of the wafer, but also reduces surface defects and stress, thereby improving the overall performance and service life of the wafer. High-quality surface treatment is the basis for manufacturing high-performance semiconductor devices.

6. Customized service:

Ultra Flat Silicon Wafers provides customized services and can adjust the parameters of the wafer, such as crystal orientation, doping concentration, thickness, etc., according to the specific needs of customers. This customized service enables customers to obtain wafers that fully meet their own process requirements, thereby improving production efficiency and product quality. Whether it is chip manufacturing for special applications or cutting-edge scientific research, it can provide personalized solutions to meet the diverse needs of customers.

7. High-purity silicon raw materials:

Ultra Flat Silicon Wafers uses high-purity electronic-grade silicon raw materials, which undergo a rigorous purification process to ensure that the purity of the wafer reaches 99.9999%. High-purity silicon raw materials are the basis for manufacturing high-quality semiconductor devices and can reduce the impact of impurities on device performance. By using high-purity silicon, Ultra Flat Silicon Wafers can provide stable electrical and mechanical properties, thereby ensuring the high quality and high reliability of the final product.

8. Strict quality control:

During the production process, each wafer of Ultra Flat Silicon Wafers undergoes rigorous quality testing, including testing of multiple parameters such as flatness, thickness, resistivity, and surface quality. This rigorous quality control system ensures that each wafer meets high standards of quality requirements. Through multiple testing processes, Ultra Flat Silicon Wafers can promptly detect and eliminate unqualified products, thereby ensuring the high quality and consistency of the products.

1. Silicon raw material purification:

The production of Ultra Flat Silicon Wafers begins with the purification of high-purity silicon raw materials. Silicon raw materials are extracted from natural quartz and, after a multi-step purification process, the purity of silicon is increased to 99.9999% electronic grade. This process is the basis for ensuring the quality of wafers. High-purity silicon raw materials can reduce the impact of impurities on device performance, thereby improving the quality and reliability of the final product.

2. Crystal growth:

Silicon single crystals are grown using the Czochralski (CZ) method or the floating zone method (FZ). After melting high-purity silicon, large-diameter single crystal silicon ingots are formed by slow crystal pulling and rotation to ensure the integrity and uniformity of the crystal structure. This process requires extremely high control of temperature and growth rate to ensure the quality and performance of the wafer. Crystal growth is one of the key steps in the manufacture of Ultra Flat Silicon Wafers.

3. Cutting and grinding:

The grown silicon ingots are cut into thin slices, usually between 200 and 300 microns thick. After cutting, the wafer is ground to remove the damaged layer generated during the cutting process and make the wafer thickness uniform. This process requires high-precision equipment and processes to ensure the flatness and thickness uniformity of the wafer. Cutting and grinding are important links in the production of Ultra Flat Silicon Wafers, which directly affect the quality of subsequent processes.

4. Polishing:

The ground wafer is double-sided polished, and high-precision polishing equipment and processes are used to make the wafer surface achieve extremely high flatness and finish. Double-sided polishing not only improves the flatness of the wafer, but also reduces surface defects and stress, thereby improving the overall performance and service life of the wafer. High-quality polishing is one of the key steps in the manufacture of Ultra Flat Silicon Wafers.

5. Doping:

According to needs, the wafer is doped to change the electrical properties of the wafer by introducing impurities such as boron and phosphorus into silicon, making it a P-type or N-type semiconductor. Doping is an important link in the manufacture of Ultra Flat Silicon Wafers, which can meet the electrical performance requirements of different electronic devices. By precisely controlling the doping concentration and distribution, the electrical properties of the wafer can be optimized.

6. Cleaning and testing:

After polishing and doping, the wafer is cleaned to remove impurities and particles remaining on the surface. Then a strict quality test is carried out, including testing of multiple parameters such as flatness, thickness, resistivity, surface quality, etc., to ensure that each wafer meets high quality standards. Cleaning and testing is the last step in the production of Ultra Flat Silicon Wafers, ensuring the high quality and consistency of the product.

1. Integrated Circuit Manufacturing:

Ultra Flat Silicon Wafers play a vital role in integrated circuit manufacturing. Its high flatness and low particle contamination characteristics can ensure high precision of lithography and etching processes, thereby improving the performance and reliability of integrated circuits. In the microelectronics manufacturing process, the flatness of the wafer directly affects the transfer accuracy of the lithography pattern, while particle contamination may cause defects such as short circuits or open circuits. These characteristics make it an ideal choice for manufacturing high-performance integrated circuits, which can meet the diverse needs from high-end processors to low-power chips.

2. Sensor Manufacturing:

In sensor manufacturing, Ultra Flat Silicon Wafers provide stable electrical properties and high-precision surfaces. This helps to improve the sensitivity and accuracy of the sensor and is widely used in the production of various sensors such as temperature, pressure, and light sensitivity. The performance of the sensor is highly dependent on the quality of the substrate material, and the high flatness and low particle contamination characteristics of Ultra Flat Silicon Wafers can ensure high-precision manufacturing of the sensor at a tiny size, thereby improving the overall performance and reliability of the sensor.

3. Micro-electromechanical systems (MEMS):

Ultra Flat Silicon Wafers are suitable for the manufacture of micro-electromechanical systems (MEMS). Its high flatness and good mechanical properties can meet the high-precision processing requirements of micro-mechanical devices. In MEMS manufacturing, wafers need to withstand complex mechanical processing and physical and chemical reactions. The high-quality surface and uniform mechanical properties of this product can ensure the stability and reliability of micro-mechanical devices. Whether it is a micromotor, micropump or micromirror, it can provide a reliable substrate material.

4. Optoelectronic devices:

In the manufacture of optoelectronic devices, Ultra Flat Silicon Wafers can meet the requirements of high-precision lithography and thin film deposition. Its high flatness and low particle contamination characteristics help to improve the luminous efficiency and stability of the device. For example, in the manufacture of light-emitting diodes (LEDs) and laser diodes (LDs), the flatness of the wafer directly affects the emission efficiency and directionality of light. Its high-quality surface treatment can ensure the stable operation of optoelectronic devices at high brightness and high efficiency.

5. Solar cells:

Ultra Flat Silicon Wafers can also be used to manufacture high-efficiency solar cells. Although traditional solar cells mostly use conventional silicon wafers, their high flatness helps improve the photoelectric conversion efficiency of the cells. In solar cell manufacturing, the flatness and surface quality of the wafer directly affect the light absorption and conversion efficiency. Its high-quality surface treatment and low particle contamination characteristics can ensure the stable operation of solar cells at high efficiency, thereby improving the overall performance of solar cells.

6. Scientific research:

In research in the fields of materials science, physics, etc., Ultra Flat Silicon Wafers can be used as experimental substrates for growing high-quality thin film materials, studying the physical properties and chemical reactions of materials, etc. Its high flatness and low particle contamination characteristics can provide ideal experimental conditions for scientific research. Whether exploring new semiconductor materials or studying the physical properties of nanostructures, it can provide high-quality substrate materials to help the in-depth development of scientific research.

The packaging should be able to withstand the impact, vibration, stacking and extrusion that may be encountered during transportation, while also it has to easy to load, unload and handle.

We use professional wafer box packaging. The wafer box is protected by a double layer bag, the inside is a PE bag that can be dust-proof, and the outside is a aluminum foil bag that can be isolated from the air. The two-layer bags are vacuum-packed. 

We will choose carton models according to different sizes of products. And between the product and the carton filled with shock-proof EPE foam, play a comprehensive protection. 

Finally choose air transport to reach the customer's hands. This allows customers in any country and region to receive the product in the fastest time.

We comply with the Material Safety Data Sheet (MSDS) rules to ensure that the products transported are free of harmful substances and will not cause environmental pollution and explosion and other possible hazards.

Factory Area: 3000 sq

Process:

1. Shaping→2. Edge Profile→3. Lapping→4. Polishing→5. Cleaning→6. Packing→7. Transportation

Capacity:

Glass Wafer --- 30K pcs 

Silicon Wafer --- 20K pcs 

(Equal to 6in) 

Quality inspection method: Product inspection in accordance with SEMI standard or according to customer's requirements, together with product COA.

Warranty period: In accordance with the contract requirements.

Quality system management：

●Organize production according to ISO9001 and other quality system standards.

Quality management system and measures:

●Establish a strict quality assurance system, the heads of all departments and quality engineers to ensure the coordinated operation of the quality system.

●Strengthen the quality inspection system, strengthen the process quality control

●Strict material quality control, ensure that the input materials meet the design requirements and technical specifications.

●Implement a timely filing system for technical data to ensure that all processing technical data is complete/accurate.

Quality control in the production stage:

●Production preparation stage: carefully organize relevant personnel to learn product drawings and technical rules, and improve the technical level of employees.

●Quality control of the production process: the implementation of a strict handover system, the previous step of the process to the next step of the transfer, should be detailed processing. At the same time, strengthen the quality inspection system to ensure the quality of each step of the process.

●Quality acceptance: All processes must be quality acceptance before proceeding to the next process.

Pre-sales Service

Professional technical support and commercial team to help you determine product specifications according to product use, and issue specifications.

On-purchase Service

Produce products according to the confirmed specifications and our process.

After Sale Service

We will respond to any product problems encountered by customers or process problems encountered by customers within 24 hours. We can choose from various forms of service, such as email, video conference and so on.