
Optical Grade LiNbO3 Wafer
Compound Semiconductor Wafers

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LiNbO₃ wafer is a compound wafer composed of niobium, lithium and oxygen. It is a negative crystal with high spontaneous polarization characteristics, and the spontaneous polarization value can reach 0.70C/m² at room temperature. In addition, it is also the ferroelectric with the highest Curie temperature discovered so far, with a Curie temperature of 1210℃. Due to its unique physical and chemical properties, this material has broad application prospects in many fields and is one of the indispensable important materials in modern science and technology.
Optical Grade LiNbO3 Wafer Specifications
Optical Grade LiNbO3 Wafer
Parameter | Specification |
Material | Optical Grade LiNbO₃ Wafers (White or Black) |
Diameter | 2inch/3inch/4inch |
Diameter Tolerance | ±0.03mm |
Curie Temp | 1142±0.2℃ |
Cutting Angle | X/Y/Z etc. |
Tol(±) | < 0.20 mm ±0.005mm |
Thickness | 0.18 ~ 0.5mm or more |
Primary Flat | 16mm/22mm /32mm |
TTV | < 3μm |
BOW | -30 |
WARP | < 40μm |
Orientation Flat | All available |
Surface Type | Single Side Polished(SSP) /Double Sides Polished(DSP) |
Polished side Ra | < 0.5nm |
S/D | 20/10 |
Edge Criteria | R=0.2mm C-type or Bullnose |
Quality | Free of crack (bubbles and inclusions) |
Optical doped | Mg/Fe/Zn/MgO etc. for optical grade |
Wafer Surface Criteria | Refractive index No=2.2878/Ne=2.2033 @632nm wavelength |
Contamination None | |
Particles @>0.3 μm ≤30 | |
Scratch , Chipping None | |
Defect No edge cracks, scratches, saw marks, stains | |
Packing | 25pcs per box |
SAW Grade Lithium Niobate Wafers
Parameter | Specification |
Material | LiNbO3 wafers (White or Black) |
Diameter | 3inch/4inch/inch LN wafer & 8inch under R/D |
Diameter Tolerance | ±0.03mm |
Curie Temp | 1142±2.0℃ |
Cutting Angle | X/Y/Z/Y36/Y41/Y64/Y128/etc. |
Tol(±) | < 0.20 mm |
Thickness | 0.18 ~ 0.5mm or more |
Primary Flat | 22mm /32mm /42.5mm /57.5mm |
LTV (5mmx5mm) | < 1μm |
TTV | < 3μm |
BOW | -30 |
WARP | < 40μm |
PLTV(<0.5um)<> | ≥95%(5mm*5mm) |
Orientation Flat | All available |
Surface Type | Single Side Polished(SSP) /Double Sides Polished(DSP) |
Polished side Ra | < 0.5nm |
Back Side Criteria | General is 0.2-0.5μm or as customized |
Edge Criteria | R=0.2mm or Bullnose |
Wafer Surface Criteria | Transmissivity general:5.9x10-11 |
Contamination None | |
Particles @ > 0.3 μm ≤30 | |
Scratch , Chipping None | |
Defect No edge cracks, scratches, saw marks, stains | |
Packing | 25pcs per box |
Optical grade LiNbO3 wafers SLN CLN
Parameter | Specification |
Material | Optical Grade LiNbO3 Wafers (White or Black) |
Diameter | 2inch/3inch/4inch |
Diameter Tolerance | ±0.03mm |
Curie Temp | 1142±0.7℃ |
Cutting Angle | X/Y/Z etc. |
Tol(±) | < 0.20 mm ±0.005mm |
Thickness | 0.18 ~ 0.5mm or more |
Primary Flat | 16mm/22mm /32mm |
TTV | < 3μm |
BOW | -30 |
WARP | < 40μm |
Orientation Flat | All available |
Surface Type | Single Side Polished(SSP) /Double Sides Polished(DSP) |
Polished side Ra | < 0.5nm |
S/D | 10月20日 |
Edge Criteria | R=0.2mm C-type or Bullnose |
Quality | Free of crack (bubbles and inclusions) |
Optical doped | Mg/Fe/Zn/MgO etc. for optical grade LN < wafers per requested |
Wafer Surface Criteria | Refractive index No=2.2878/Ne=2.2033 @632nm wavelength/prism coupler method. |
Contamination None | |
Particles @ > 0.3 μm ≤30 | |
Scratch , Chipping None | |
Defect No edge cracks, scratches, saw marks, stains | |
Packing | 25pcs per box |
Optical Grade LiNbO3 Wafer Features
1. High-purity materials:
Optical Grade LiNbO₃ Wafer uses high-purity LiNbO₃ as the substrate, with a purity of more than 99.99%. This high-purity material can effectively reduce the impact of impurities on performance and ensure the stability of the optical and electrical properties of the wafer. According to industry standards, high-purity LiNbO₃ wafers can provide better light transmittance and lower absorption loss in optical applications, meeting the needs of high-end optical equipment.
2. Precise size control:
The diameter of the LiNbO3 Wafer is 2 inches, 3 inches and 4 inches, and the diameter tolerance is controlled within ±0.03mm. This precise size control meets the strict standards of the semiconductor industry and can ensure the adaptability of the wafer during processing and assembly. For example, in the manufacture of photonic integrated chips, precise dimensions can ensure the precise alignment and efficient integration of chips and improve production yield.
3. Excellent Curie temperature:
The Curie temperature of Optical Grade LiNbO₃ Wafer is 1142±0.2℃. This high Curie temperature allows the wafer to maintain good ferroelectric properties in high temperature environments. In some application scenarios that require high temperature operation, such as high-temperature optical sensors, this high Curie temperature wafer can work stably and will not lose function due to temperature increase.
4. Multiple cutting angle options:
LiNbO3 Wafer provides multiple cutting angles such as X/Y/Z, and the cutting angle tolerance is ±0.005mm. This high-precision cutting angle control can meet the needs of different applications. For example, in acoustic applications, specific cutting angles can optimize the propagation characteristics of sound waves and improve the performance of acoustic devices. This diverse selection of cutting angles provides users with more design freedom.
5. Excellent surface quality:
Optical Grade LiNbO₃ Wafer provides two surface types: single-sided polishing (SSP) and double-sided polishing (DSP). The surface roughness (Ra) of the polished surface is less than 0.5nm, which meets the requirements of high-end optical applications. This ultra-smooth surface can effectively reduce light scattering and reflection losses, and improve the efficiency and performance of optical devices. For example, in optical communication applications, the ultra-smooth surface can ensure high-quality transmission of optical signals.
6. Strict quality control:
LiNbO3 Wafer undergoes strict quality inspection to ensure that there are no cracks, bubbles and inclusions. This high quality standard meets the strict requirements of the semiconductor industry and can ensure the reliability and stability of the wafer during use. For example, in the manufacture of photonic integrated chips, defect-free wafers can effectively reduce the chip failure rate and improve the overall performance of the product.
7. Optical doping technology:
Optical Grade LiNbO₃ Wafer uses optical doping technology, which can be doped with various elements such as Mg, Fe, Zn, MgO, etc. This doping technology can adjust the optical properties of the wafer according to different application requirements. For example, in optical communication applications, doping can optimize the refractive index and light loss characteristics of the wafer and improve communication efficiency.
8. Customized service:
Plutosemi provides customized services, which can adjust the size, thickness, cutting angle and other parameters of LiNbO3 Wafer according to the special needs of customers. This customized service can meet the personalized needs of different customers and ensure that the product can perfectly adapt to the customer's equipment and applications. For example, for some optical devices with special shapes, customized wafers can provide better adaptability.
Optical Grade LiNbO3 Wafer Process Flow
Raw material selection:
Plutosemi strictly selects high-purity LiNbO₃ raw materials when producing Optical Grade LiNbO₃ Wafer. Through advanced testing equipment, the purity of the raw materials is ensured to reach more than 99.99%, laying the foundation for subsequent high-quality production.
Crystal growth:
Advanced crystal growth techniques such as Czochralski or zone melting are used to accurately control the growth process of the crystal. By optimizing growth parameters such as temperature, pressure and growth rate, high-quality crystal growth is ensured and crystal defects are reduced.
Cutting and grinding:
Use high-precision cutting equipment to cut according to the size and cutting angle required by the customer. The cut wafers are finely ground to ensure that the dimensional accuracy and surface flatness meet industry standards.
Polishing:
Advanced polishing process is used to polish the surface of LiNbO3 wafer on one side or both sides. By optimizing polishing parameters, the surface roughness (Ra) is ensured to be less than 0.5nm, which meets the requirements of high-end optical applications.
Quality inspection:
During the production process, each LiNbO3 wafer is strictly inspected for quality. The inspection contents include dimensional accuracy, surface quality, optical performance, etc. Through strict quality control, we ensure that each wafer can meet the high quality requirements of customers.
Customized processing:
Customized processing services are provided according to the special needs of customers. Including adjusting the size, thickness, cutting angle and other parameters of LiNbO3 wafer to ensure that the product can perfectly adapt to the customer's equipment and applications.
Optical Grade LiNbO3 Wafer Application
1. Piezoelectric Applications:
Optical Grade LiNbO₃ Wafer performs well in piezoelectric applications. Its high spontaneous polarization and high Curie temperature characteristics enable it to efficiently convert mechanical energy into electrical energy, or vice versa. For example, in piezoelectric sensors, this wafer can accurately detect tiny mechanical vibrations and convert them into electrical signals, and is widely used in pressure sensors, accelerometers and other fields.
2. Optical Applications:
This product has a wide range of applications in the optical field. Its high purity and ultra-smooth surface can effectively reduce the scattering and reflection loss of light and improve the efficiency of optical devices. For example, in optical filters, Optical Grade LiNbO₃ Wafer can accurately control the transmittance and reflectivity of light, achieve selective transmission of specific wavelengths, and is widely used in optical communications, optical imaging and other fields.
3. Dielectric Superlattice Applications:
Optical Grade LiNbO₃ Wafer can be used in the field of dielectric superlattices. Its high Curie temperature and good ferroelectric properties enable it to maintain stable dielectric properties in high temperature environments. For example, in dielectric superlattice devices, this wafer can achieve efficient electric field modulation and improve the performance and stability of the device.
4. Acoustic Applications:
This product has important application value in the field of acoustics. Its specific cutting angle and high-precision size control can optimize the propagation characteristics of sound waves. For example, in surface acoustic wave filters, Optical Grade LiNbO₃ Wafer can accurately control the frequency and phase of sound waves, achieve efficient signal processing, and is widely used in communications, radar and other fields.
5. Optical Communication Applications:
Optical Grade LiNbO₃ Wafer has a wide range of applications in the field of optical communications. Its high purity and ultra-smooth surface can effectively reduce the loss of light and improve the transmission efficiency of optical signals. For example, in optical communication devices, this wafer can achieve efficient optical signal modulation and demodulation, and improve the performance and reliability of communication systems.
6. Photonic Integrated Chip Applications:
This product has important application value in the field of photonic integrated chips. Its high purity, ultra-smooth surface and multiple doping technologies can meet the high performance requirements of photonic integrated chips. For example, in photonic integrated chips, Optical Grade LiNbO₃ Wafer can achieve efficient optical signal processing and transmission, improving the integration and performance of the chip.
Packaging and Transportation
The packaging should be able to withstand the impact, vibration, stacking and extrusion that may be encountered during transportation, while also it has to easy to load, unload and handle.
We use professional wafer box packaging. The wafer box is protected by a double layer bag, the inside is a PE bag that can be dust-proof, and the outside is a aluminum foil bag that can be isolated from the air. The two-layer bags are vacuum-packed.
We will choose carton models according to different sizes of products. And between the product and the carton filled with shock-proof EPE foam, play a comprehensive protection.
Finally choose air transport to reach the customer's hands. This allows customers in any country and region to receive the product in the fastest time.
We comply with the Material Safety Data Sheet (MSDS) rules to ensure that the products transported are free of harmful substances and will not cause environmental pollution and explosion and other possible hazards.
Enterprise Strength
Factory Area: 3000 sq
Process:
1. Shaping→2. Edge Profile→3. Lapping→4. Polishing→5. Cleaning→6. Packing→7. Transportation
Capacity:
Glass Wafer --- 30K pcs
Silicon Wafer --- 20K pcs
(Equal to 6in)
Quality Assurance
Quality inspection method: Product inspection in accordance with SEMI standard or according to customer's requirements, together with product COA.
Warranty period: In accordance with the contract requirements.
Quality system management:
●Organize production according to ISO9001 and other quality system standards.
Quality management system and measures:
●Establish a strict quality assurance system, the heads of all departments and quality engineers to ensure the coordinated operation of the quality system.
●Strengthen the quality inspection system, strengthen the process quality control
●Strict material quality control, ensure that the input materials meet the design requirements and technical specifications.
●Implement a timely filing system for technical data to ensure that all processing technical data is complete/accurate.
Quality control in the production stage:
●Production preparation stage: carefully organize relevant personnel to learn product drawings and technical rules, and improve the technical level of employees.
●Quality control of the production process: the implementation of a strict handover system, the previous step of the process to the next step of the transfer, should be detailed processing. At the same time, strengthen the quality inspection system to ensure the quality of each step of the process.
●Quality acceptance: All processes must be quality acceptance before proceeding to the next process.
Pre-sales and After-sales
Pre-sales Service
Professional technical support and commercial team to help you determine product specifications according to product use, and issue specifications.
On-purchase Service
Produce products according to the confirmed specifications and our process.
After Sale Service
We will respond to any product problems encountered by customers or process problems encountered by customers within 24 hours. We can choose from various forms of service, such as email, video conference and so on.
Plutosemi Co., Ltd. was established in 2019, headquartered in Nanhai, Foshan, focusing on the research and development, production, and sales of high-performance semiconductor materials.
Advanced production capacity: We have three major production bases in China, with a monthly production capacity of 100000 equivalent 6-inch silicon wafers and 30000 equivalent 8-inch glass wafers, ensuring stable and efficient product supply for our customers.
High quality products: We provide efficient and stable product supply innovative solutions in the fields of glass wafers, silicon polishing wafers, epitaxial wafers (EPI), silicon on insulator wafers (SOI), and more. Our silicon wafers have the characteristics of ultra-thin, ultraflat, and high-precision, which can meet the needs of various high-end applications. Our glass and quartz substrates are also renowned for their high smoothness and precise aperture design.