
Polished Lithium Tantalate Wafer
Compound Semiconductor Wafers

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lithium tantalate wafer, also known as lithium tantalate wafer, is a single crystal material composed of lithium, tantalum and oxygen, with the chemical formula LiTaO₃. This crystal has excellent physical and chemical stability and is widely used in modern electronic and optoelectronic devices. It is usually based on high-quality single crystal growth and is made into standard-sized wafers through precision cutting, grinding and polishing. As a multifunctional crystal material, lithium tantalate wafers have become an important part of advanced electronic material systems.
Polished Lithium Tantalate Wafer Specifications
Fe doped LT Wafers
Parameter | Specification |
Material | LiTaO3 wafers(White or Black &Fe doped) |
Diameter | 3inch/4inch/6inch |
Diameter Tolerance | ±0.03mm |
Curie Temp | 603±2℃ |
Cutting Angle | X/Y/Z/X112Y/Y36/Y42/Y48/etc |
Tol(±) | < 0.20 mm |
Thickness | 0.18 ~ 0.5mm or more |
Primary Flat | 22mm /32mm /42.5mm /57.5mm |
LTV (5mmx5mm) | < 1μm |
TTV | < 3μm |
BOW | -30 |
WARP | < 40μm |
PLTV(<0.5um)<> | ≥95%(5mm*5mm) |
Orientation Flat | All available |
Surface Type | Single Side Polished(SSP) /Double Sides Polished(DSP) |
Polished side Ra | < 0.5nm |
Back Side Criteria | General is 0.2-0.5μm or as customized |
Edge Criteria | R=0.2mm or Bullnose |
Fe doped | Fe doped for saw grade LN < wafers |
Wafer Surface Criteria | Transmissivity general: 5.9x10-11 < s<2.0*10-11 |
Contamination None | |
Particles @>0.3 μm ≤30 | |
Scratch, Chipping None | |
Defect No edge cracks, scratches, saw marks, stains | |
Packing | 25pcs per box |
Optical Grade Lithium Tantalate Wafers
Parameter | Specification |
Material | LiTaO3 wafers(White or Black) |
Diameter | 2inch/3inch/4inch |
Diameter Tolerance | ±0.03mm |
Curie Temp | 603±2℃ |
Cutting Angle | X/Y/Z etc. |
Tol(±) | < 0.20 mm |
Thickness | 0.18 ~ 0.5mm or more |
Primary Flat | 16mm/22mm /32mm |
TTV | < 3μm |
BOW | -30 |
WARP | < 40μm |
Surface Type | Single Side Polished(SSP) /Double Sides Polished(DSP) |
Polished side Ra | < 0.5nm |
Back Side Criteria | General is 0.2-0.5μm or as customized |
Edge Criteria | R=0.2mm or Bullnose |
Optical doped | Zn/MgO etc. |
Wafer Surface Criteria | Contamination None |
Particles @>0.3 μm ≤30 | |
Scratch, Chipping None | |
Defect No edge cracks, scratches, saw marks, stains | |
Packing | 25pcs per box |
SAW Grade Lithium Tantalate Wafers
Parameter | Specification |
Material | LiTaO3 wafers |
Diameter | 3inch/4inch/6inch |
Diameter Tolerance | ±0.03mm |
Curie Temp | 603±2℃ |
Cutting Angle | X/Y/Z/X112Y/Y36/Y42/Y48/etc. |
Tol(±) | < 0.20 mm |
Thickness | 0.18 ~ 0.5mm or more |
Primary Flat | 22mm /32mm /42.5mm /57.5mm |
LTV (5mmx5mm) | < 1μm |
TTV | <3μm |
BOW | -30 < bow < 30 |
WARP | < 40μm |
PLTV(<0.5um)<> | ≥95%(5mm*5mm) |
Orientation Flat | All available |
Surface Type | Single Side Polished(SSP) /Double Sides Polished(DSP) |
Polished side Ra | < 0.5nm |
Back Side Criteria | General is 0.2-0.5μm or as customized |
Edge Criteria | R=0.2mm or Bullnose |
Wafer Surface Criteria | Transmissivity general:5.9x10-11 < s < 2.0*10- |
Contamination None | |
Particles @>0.3 μm ≤30 | |
Scratch , Chipping None | |
Defect No edge cracks, scratches, saw marks, stains | |
Packing | 25pcs per box |
Polished Lithium Tantalate Wafer Features
1. High chemical stability:
Lithium Tantalate Wafer has extremely high chemical inertness and hardly reacts with common chemical reagents such as water, acid, and alkali at room temperature and pressure. Its structure is stable and not prone to corrosion or degradation. It can maintain good physical and electrical properties even in high temperature and high humidity environments. This excellent chemical stability enables it to maintain long-term reliability under complex environmental conditions.
2. Excellent pyroelectric performance:
Lithium Tantalate Wafer has a significant pyroelectric effect, that is, it can spontaneously release charge when the temperature changes. This characteristic originates from the response mechanism of its ferroelectric crystal structure. Its high pyroelectric coefficient and low dielectric loss make it sensitive and stable in temperature fluctuations.
3. Good piezoelectric performance:
Lithium Tantalate Wafer has excellent piezoelectric properties, which can generate electrical signals under mechanical stress and reversibly convert electrical energy into mechanical vibrations. It has a good electromechanical coupling coefficient and a wide frequency response range. It is suitable for signal conversion and energy transfer processes in high frequency bands and exhibits strong dynamic response capabilities.
4. High Curie temperature:
The Curie temperature of LiTaO₃ exceeds 600℃, indicating that it can maintain a stable ferroelectric state in a high temperature environment. This feature means that the material is not prone to depolarization after experiencing drastic temperature changes, thus ensuring that its electrical performance will not be significantly attenuated under extreme temperature conditions.
5. Excellent optical properties:
LiTaO₃ wafers have good transmittance in the visible to near-infrared band, and also have certain nonlinear optical properties. Its optical anisotropy is small, the refractive index distribution is uniform, and the surface smoothness is high, which is conducive to achieving high-quality light transmission and regulation functions.
6. Low dielectric loss:
LiTaO₃ wafers exhibit extremely low dielectric loss under the action of an alternating electric field, which means that it generates less heat and energy loss during the power transfer process. This feature helps to improve the working efficiency and operating stability of electronic devices, especially under high-frequency working conditions.
7. Good mechanical strength:
LiTaO₃ wafers have high hardness and bending strength, and can withstand certain external impacts without breaking easily. Its crystal structure is dense, and it is not easy to produce cracks or collapse during processing. It has good processability and yield rate, and is suitable for a variety of precision manufacturing processes.
8. Environmental protection and safety:
LiTaO₃ is a lead-free, environmentally friendly functional crystal material that does not contain heavy metal elements that are harmful to the human body and the environment. Its preparation and use process meets modern green manufacturing standards, is easy to recycle, supports sustainable development strategies, and is one of the important development directions of high-performance electronic materials in the future.
Polished Lithium Tantalate Wafer Process Flow
1. Single crystal growth
The production of LiTaO₃ wafers begins with the growth of high-quality single crystals. Using the Czochralski method or the Bridgman method, the crystal is slowly cooled and crystallized in a high-temperature molten state to ensure that the crystal structure is complete and has few defects. This process requires strict control of the temperature gradient and growth rate to obtain large-size, high-purity LiTaO₃ single crystal ingots.
2. Crystal orientation and cutting
The grown LiTaO₃ crystals need to be analyzed by X-ray diffraction to determine the direction of their crystal axes. Then, diamond saw blades are used to cut them into thin slices according to specific crystal directions to ensure that the anisotropic properties of subsequent processing are consistent. Mechanical damage should be avoided during the cutting process to prevent the formation of microcracks.
3. Surface grinding and rough polishing
The cut wafers enter the grinding stage, and diamond abrasives of different particle sizes are used to gradually remove the surface damage layer. Rough polishing is then performed to further flatten the surface and reduce scratches. This step directly affects the surface quality and optical properties of the final wafer.
4. Precision polishing and cleaning
The fine polishing process uses ultra-fine polishing liquid and soft polishing pads to make the wafer surface smooth at the nanometer level. After polishing, multiple ultrasonic cleanings are performed to remove residual particles and organic pollutants to ensure that the wafer surface is clean and free of impurities to meet the requirements of high-precision device manufacturing.
5. Testing and grading packaging
Finally, the wafer is subjected to multiple tests such as thickness, resistivity, surface roughness, and crystal integrity. Product quality is evaluated by optical microscopy, atomic force microscopy, XRD and other means. Qualified wafers are classified by specifications and stored in the warehouse after vacuum packaging to ensure stability and safety during transportation and storage.
Polished Lithium Tantalate Wafer Application
1. Infrared detectors
Lithium Tantalate Wafer is widely used in the manufacture of infrared detectors due to its superior pyroelectric performance. Its high sensitivity and fast response characteristics make it suitable for a variety of infrared sensing application scenarios such as security monitoring, fire alarm, and human body sensing.
2. Surface acoustic wave devices
Lithium Tantalate Wafer is an ideal material for manufacturing surface acoustic wave (SAW) devices, and is often used in communication components such as high-frequency filters and resonators. Its excellent electromechanical coupling coefficient and temperature stability make it outstanding in mobile communications, satellite communications and other fields.
3. Laser modulators
Lithium Tantalate Wafer has a good electro-optical effect and can be used to manufacture laser modulators. It is widely used in optical fiber communications, laser radars and optical information processing systems to achieve precise control and modulation of laser beams.
4. Medical imaging equipment
LiTaO₃ wafers are used as infrared detection materials in medical imaging equipment for thermal imaging, body temperature monitoring and other systems. Its high resolution and fast response capabilities improve diagnostic efficiency and image quality.
5. Wireless communication module
LiTaO₃ wafers are used as filter and transducer materials in wireless communication modules, supporting the development of wireless communication technologies such as Bluetooth, Wi-Fi, 4G/5G, and ensuring the stability and clarity of signal transmission.
6. Industrial automation control
LiTaO₃ wafers are widely used in industrial automation control systems due to their excellent pyroelectric and piezoelectric properties, such as temperature monitoring, pressure sensors, vibration detection, etc., providing a reliable data acquisition basis for intelligent manufacturing.
Packaging and Transportation
The packaging should be able to withstand the impact, vibration, stacking and extrusion that may be encountered during transportation, while also it has to easy to load, unload and handle.
We use professional wafer box packaging. The wafer box is protected by a double layer bag, the inside is a PE bag that can be dust-proof, and the outside is a aluminum foil bag that can be isolated from the air. The two-layer bags are vacuum-packed.
We will choose carton models according to different sizes of products. And between the product and the carton filled with shock-proof EPE foam, play a comprehensive protection.
Finally choose air transport to reach the customer's hands. This allows customers in any country and region to receive the product in the fastest time.
We comply with the Material Safety Data Sheet (MSDS) rules to ensure that the products transported are free of harmful substances and will not cause environmental pollution and explosion and other possible hazards.
Enterprise Strength
Factory Area: 3000 sq
Process:
1. Shaping→2. Edge Profile→3. Lapping→4. Polishing→5. Cleaning→6. Packing→7. Transportation
Capacity:
Glass Wafer --- 30K pcs
Silicon Wafer --- 20K pcs
(Equal to 6in)
Quality Assurance
Quality inspection method: Product inspection in accordance with SEMI standard or according to customer's requirements, together with product COA.
Warranty period: In accordance with the contract requirements.
Quality system management:
●Organize production according to ISO9001 and other quality system standards.
Quality management system and measures:
●Establish a strict quality assurance system, the heads of all departments and quality engineers to ensure the coordinated operation of the quality system.
●Strengthen the quality inspection system, strengthen the process quality control
●Strict material quality control, ensure that the input materials meet the design requirements and technical specifications.
●Implement a timely filing system for technical data to ensure that all processing technical data is complete/accurate.
Quality control in the production stage:
●Production preparation stage: carefully organize relevant personnel to learn product drawings and technical rules, and improve the technical level of employees.
●Quality control of the production process: the implementation of a strict handover system, the previous step of the process to the next step of the transfer, should be detailed processing. At the same time, strengthen the quality inspection system to ensure the quality of each step of the process.
●Quality acceptance: All processes must be quality acceptance before proceeding to the next process.
Pre-sales and After-sales
Pre-sales Service
Professional technical support and commercial team to help you determine product specifications according to product use, and issue specifications.
On-purchase Service
Produce products according to the confirmed specifications and our process.
After Sale Service
We will respond to any product problems encountered by customers or process problems encountered by customers within 24 hours. We can choose from various forms of service, such as email, video conference and so on.
Plutosemi Co., Ltd. was established in 2019, headquartered in Nanhai, Foshan, focusing on the research and development, production, and sales of high-performance semiconductor materials.
Advanced production capacity: We have three major production bases in China, with a monthly production capacity of 100000 equivalent 6-inch silicon wafers and 30000 equivalent 8-inch glass wafers, ensuring stable and efficient product supply for our customers.
High quality products: We provide efficient and stable product supply innovative solutions in the fields of glass wafers, silicon polishing wafers, epitaxial wafers (EPI), silicon on insulator wafers (SOI), and more. Our silicon wafers have the characteristics of ultra-thin, ultraflat, and high-precision, which can meet the needs of various high-end applications. Our glass and quartz substrates are also renowned for their high smoothness and precise aperture design.