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HomeProducts Compound Semiconductor Wafers Polished Lithium Tantalate Wafer
Polished Lithium Tantalate Wafer

Polished Lithium Tantalate Wafer

Compound Semiconductor Wafers

Lithium tantalate (LiTaO3) crystal is an excellent multifunctional material with high application value. LiTaO3 crystal has become the best choice of pyroelectric infrared detector materials due to its stable and high chemical properties (insoluble and water), curie point higher than 600℃, not easy to depolarization phenomenon, low dielectric loss, and high optimal detection rate.
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Products Description

lithium tantalate wafer, also known as lithium tantalate wafer, is a single crystal material composed of lithium, tantalum and oxygen, with the chemical formula LiTaO₃. This crystal has excellent physical and chemical stability and is widely used in modern electronic and optoelectronic devices. It is usually based on high-quality single crystal growth and is made into standard-sized wafers through precision cutting, grinding and polishing. As a multifunctional crystal material, lithium tantalate wafers have become an important part of advanced electronic material systems.


Polished Lithium Tantalate Wafer

Polished Lithium Tantalate Wafer Specifications

Fe doped LT Wafers

ParameterSpecification
MaterialLiTaO3 wafers(White or Black &Fe doped)
Diameter3inch/4inch/6inch
Diameter Tolerance±0.03mm
Curie Temp603±2℃
Cutting AngleX/Y/Z/X112Y/Y36/Y42/Y48/etc
Tol(±)< 0.20 mm
Thickness0.18 ~ 0.5mm or more
Primary Flat22mm /32mm /42.5mm /57.5mm
LTV (5mmx5mm)< 1μm
TTV< 3μm
BOW-30
WARP< 40μm
PLTV(<0.5um)<>≥95%(5mm*5mm)
Orientation FlatAll available
Surface TypeSingle Side Polished(SSP) /Double Sides Polished(DSP)
Polished side Ra< 0.5nm
Back Side CriteriaGeneral is 0.2-0.5μm or as customized
Edge CriteriaR=0.2mm or Bullnose
Fe dopedFe doped for saw grade LN < wafers
Wafer Surface CriteriaTransmissivity general: 5.9x10-11 < s<2.0*10-11                                    -10 at 25℃                
Contamination None
Particles @>0.3 μm ≤30
Scratch, Chipping None
Defect No edge cracks, scratches, saw marks, stains
Packing25pcs per box


Optical Grade Lithium Tantalate Wafers

ParameterSpecification
MaterialLiTaO3 wafers(White or Black)
Diameter2inch/3inch/4inch
Diameter Tolerance±0.03mm
Curie Temp603±2℃
Cutting AngleX/Y/Z etc.
Tol(±)< 0.20 mm
Thickness0.18 ~ 0.5mm or more
Primary Flat16mm/22mm /32mm
TTV< 3μm
BOW-30
WARP< 40μm
Surface TypeSingle Side Polished(SSP) /Double Sides   Polished(DSP)
Polished side Ra< 0.5nm
Back Side CriteriaGeneral is 0.2-0.5μm or as customized
Edge CriteriaR=0.2mm or Bullnose
Optical dopedZn/MgO etc.
Wafer Surface CriteriaContamination  None
Particles @>0.3 μm  ≤30
Scratch, Chipping None
Defect No edge cracks, scratches, saw marks, stains
Packing25pcs per box

SAW Grade Lithium Tantalate Wafers

ParameterSpecification
MaterialLiTaO3 wafers
Diameter3inch/4inch/6inch
Diameter Tolerance±0.03mm
Curie Temp603±2℃
Cutting AngleX/Y/Z/X112Y/Y36/Y42/Y48/etc.
Tol(±)< 0.20 mm
Thickness0.18 ~ 0.5mm or more
Primary Flat22mm /32mm /42.5mm /57.5mm
LTV (5mmx5mm)< 1μm 
TTV <3μm
BOW-30 < bow < 30
WARP< 40μm
PLTV(<0.5um)<>≥95%(5mm*5mm)
Orientation FlatAll available
Surface TypeSingle Side Polished(SSP) /Double Sides Polished(DSP)
Polished side Ra< 0.5nm
Back Side CriteriaGeneral is 0.2-0.5μm or as customized
Edge CriteriaR=0.2mm or Bullnose
Wafer Surface CriteriaTransmissivity   general:5.9x10-11 < s < 2.0*10-                                    10 at 25℃< /s < 2.0*10                
Contamination       None
Particles @>0.3 μm  ≤30
Scratch , Chipping   None
Defect              No edge cracks, scratches, saw marks, stains
Packing25pcs per box

Polished Lithium Tantalate Wafer Features

1. High chemical stability:

Lithium Tantalate Wafer has extremely high chemical inertness and hardly reacts with common chemical reagents such as water, acid, and alkali at room temperature and pressure. Its structure is stable and not prone to corrosion or degradation. It can maintain good physical and electrical properties even in high temperature and high humidity environments. This excellent chemical stability enables it to maintain long-term reliability under complex environmental conditions.


2. Excellent pyroelectric performance:

Lithium Tantalate Wafer has a significant pyroelectric effect, that is, it can spontaneously release charge when the temperature changes. This characteristic originates from the response mechanism of its ferroelectric crystal structure. Its high pyroelectric coefficient and low dielectric loss make it sensitive and stable in temperature fluctuations.


3. Good piezoelectric performance:

Lithium Tantalate Wafer has excellent piezoelectric properties, which can generate electrical signals under mechanical stress and reversibly convert electrical energy into mechanical vibrations. It has a good electromechanical coupling coefficient and a wide frequency response range. It is suitable for signal conversion and energy transfer processes in high frequency bands and exhibits strong dynamic response capabilities.


4. High Curie temperature:

The Curie temperature of LiTaO₃ exceeds 600℃, indicating that it can maintain a stable ferroelectric state in a high temperature environment. This feature means that the material is not prone to depolarization after experiencing drastic temperature changes, thus ensuring that its electrical performance will not be significantly attenuated under extreme temperature conditions.


5. Excellent optical properties:

LiTaO₃ wafers have good transmittance in the visible to near-infrared band, and also have certain nonlinear optical properties. Its optical anisotropy is small, the refractive index distribution is uniform, and the surface smoothness is high, which is conducive to achieving high-quality light transmission and regulation functions.


6. Low dielectric loss:

LiTaO₃ wafers exhibit extremely low dielectric loss under the action of an alternating electric field, which means that it generates less heat and energy loss during the power transfer process. This feature helps to improve the working efficiency and operating stability of electronic devices, especially under high-frequency working conditions.


7. Good mechanical strength:

LiTaO₃ wafers have high hardness and bending strength, and can withstand certain external impacts without breaking easily. Its crystal structure is dense, and it is not easy to produce cracks or collapse during processing. It has good processability and yield rate, and is suitable for a variety of precision manufacturing processes.


8. Environmental protection and safety:

LiTaO₃ is a lead-free, environmentally friendly functional crystal material that does not contain heavy metal elements that are harmful to the human body and the environment. Its preparation and use process meets modern green manufacturing standards, is easy to recycle, supports sustainable development strategies, and is one of the important development directions of high-performance electronic materials in the future.


Polished Lithium Tantalate Wafer Process Flow

1. Single crystal growth

The production of LiTaO₃ wafers begins with the growth of high-quality single crystals. Using the Czochralski method or the Bridgman method, the crystal is slowly cooled and crystallized in a high-temperature molten state to ensure that the crystal structure is complete and has few defects. This process requires strict control of the temperature gradient and growth rate to obtain large-size, high-purity LiTaO₃ single crystal ingots.


2. Crystal orientation and cutting

The grown LiTaO₃ crystals need to be analyzed by X-ray diffraction to determine the direction of their crystal axes. Then, diamond saw blades are used to cut them into thin slices according to specific crystal directions to ensure that the anisotropic properties of subsequent processing are consistent. Mechanical damage should be avoided during the cutting process to prevent the formation of microcracks.


3. Surface grinding and rough polishing

The cut wafers enter the grinding stage, and diamond abrasives of different particle sizes are used to gradually remove the surface damage layer. Rough polishing is then performed to further flatten the surface and reduce scratches. This step directly affects the surface quality and optical properties of the final wafer.


4. Precision polishing and cleaning

The fine polishing process uses ultra-fine polishing liquid and soft polishing pads to make the wafer surface smooth at the nanometer level. After polishing, multiple ultrasonic cleanings are performed to remove residual particles and organic pollutants to ensure that the wafer surface is clean and free of impurities to meet the requirements of high-precision device manufacturing.


5. Testing and grading packaging

Finally, the wafer is subjected to multiple tests such as thickness, resistivity, surface roughness, and crystal integrity. Product quality is evaluated by optical microscopy, atomic force microscopy, XRD and other means. Qualified wafers are classified by specifications and stored in the warehouse after vacuum packaging to ensure stability and safety during transportation and storage.


Polished Lithium Tantalate Wafer Application

1. Infrared detectors

Lithium Tantalate Wafer is widely used in the manufacture of infrared detectors due to its superior pyroelectric performance. Its high sensitivity and fast response characteristics make it suitable for a variety of infrared sensing application scenarios such as security monitoring, fire alarm, and human body sensing.


2. Surface acoustic wave devices

Lithium Tantalate Wafer is an ideal material for manufacturing surface acoustic wave (SAW) devices, and is often used in communication components such as high-frequency filters and resonators. Its excellent electromechanical coupling coefficient and temperature stability make it outstanding in mobile communications, satellite communications and other fields.


3. Laser modulators

Lithium Tantalate Wafer has a good electro-optical effect and can be used to manufacture laser modulators. It is widely used in optical fiber communications, laser radars and optical information processing systems to achieve precise control and modulation of laser beams.


4. Medical imaging equipment

LiTaO₃ wafers are used as infrared detection materials in medical imaging equipment for thermal imaging, body temperature monitoring and other systems. Its high resolution and fast response capabilities improve diagnostic efficiency and image quality.


5. Wireless communication module

LiTaO₃ wafers are used as filter and transducer materials in wireless communication modules, supporting the development of wireless communication technologies such as Bluetooth, Wi-Fi, 4G/5G, and ensuring the stability and clarity of signal transmission.


6. Industrial automation control

LiTaO₃ wafers are widely used in industrial automation control systems due to their excellent pyroelectric and piezoelectric properties, such as temperature monitoring, pressure sensors, vibration detection, etc., providing a reliable data acquisition basis for intelligent manufacturing.


Packaging and Transportation

The packaging should be able to withstand the impact, vibration, stacking and extrusion that may be encountered during transportation, while also it has to easy to load, unload and handle.

We use professional wafer box packaging. The wafer box is protected by a double layer bag, the inside is a PE bag that can be dust-proof, and the outside is a aluminum foil bag that can be isolated from the air. The two-layer bags are vacuum-packed. 

We will choose carton models according to different sizes of products. And between the product and the carton filled with shock-proof EPE foam, play a comprehensive protection. 

Finally choose air transport to reach the customer's hands. This allows customers in any country and region to receive the product in the fastest time.

We comply with the Material Safety Data Sheet (MSDS) rules to ensure that the products transported are free of harmful substances and will not cause environmental pollution and explosion and other possible hazards.


Packaging and Transportation

Enterprise Strength

Factory Area: 3000 sq


Process:

1. Shaping→2. Edge Profile→3. Lapping→4. Polishing→5. Cleaning→6. Packing→7. Transportation


Capacity:

Glass Wafer --- 30K pcs 

Silicon Wafer --- 20K pcs 

(Equal to 6in) 


Enterprise Strength

Quality Assurance

Quality inspection method: Product inspection in accordance with SEMI standard or according to customer's requirements, together with product COA.


Warranty period: In accordance with the contract requirements.


Quality system management:

●Organize production according to ISO9001 and other quality system standards.

Quality management system and measures:

●Establish a strict quality assurance system, the heads of all departments and quality engineers to ensure the coordinated operation of the quality system.

●Strengthen the quality inspection system, strengthen the process quality control

●Strict material quality control, ensure that the input materials meet the design requirements and technical specifications.

●Implement a timely filing system for technical data to ensure that all processing technical data is complete/accurate.


Quality control in the production stage:

●Production preparation stage: carefully organize relevant personnel to learn product drawings and technical rules, and improve the technical level of employees.

●Quality control of the production process: the implementation of a strict handover system, the previous step of the process to the next step of the transfer, should be detailed processing. At the same time, strengthen the quality inspection system to ensure the quality of each step of the process.

●Quality acceptance: All processes must be quality acceptance before proceeding to the next process.


Quality Assurance

Pre-sales and After-sales

Pre-sales Service

Professional technical support and commercial team to help you determine product specifications according to product use, and issue specifications.


On-purchase Service

Produce products according to the confirmed specifications and our process.


After Sale Service

We will respond to any product problems encountered by customers or process problems encountered by customers within 24 hours. We can choose from various forms of service, such as email, video conference and so on.


About Us PLUTOSEMI

Plutosemi Co., Ltd.  was established in 2019, headquartered in Nanhai, Foshan, focusing on the research and development, production, and sales of high-performance semiconductor materials. 

Advanced production capacity: We have three major production bases in China, with a monthly production capacity of 100000 equivalent 6-inch silicon wafers and 30000 equivalent 8-inch glass wafers, ensuring stable and efficient product supply for our customers.

High quality products: We provide efficient and stable product supply innovative solutions in the fields of glass wafers, silicon polishing wafers, epitaxial wafers (EPI), silicon on insulator wafers (SOI), and more. Our silicon wafers have the characteristics of ultra-thin, ultraflat, and high-precision, which can meet the needs of various high-end applications. Our glass and quartz substrates are also renowned for their high smoothness and precise aperture design.

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