Silicon Wafers are standardized by diameter (inches or millimeters) and defined further by thickness and flatness to meet different device and packaging needs. In mainstream manufacturing today, wafers are typically 100 mm (4 in.), 150 mm (6 in.), 200 mm (8 in.), and 300 mm (12 in.) in diameter. Among these, 300 mm has become the workhorse size for high-volume logic and memory, while 150–200 mm remain widely used for power devices, MEMS, sensors, and analog ICs.

Beyond diameter, thickness scales with wafer size for mechanical strength and handling. As a general guide, 200 mm wafers are commonly ~675–725 µm thick, and 300 mm wafers are typically ~775–825 µm—figures that help fabs tune automation, carriers, and polishing/etch processes.

Standard Wafer Diameters and Typical Thickness

The table below summarizes common silicon wafer sizes Plutosemi supports directly or alongside related substrate platforms, with typical thickness bands for context.

Thickness can be tailored during lapping, grinding, and CMP; ultra-thin formats are also available for advanced packaging, while ultra-flat wafers with TTV ≤ 1 µm support tight overlay budgets in lithography-intensive flows.

What “Size” Means in Practice

• Diameter dictates tool set compatibility (carriers, robots, aligners, lithography stages) and throughput per wafer. Moving from 200 mm to 300 mm increases die output per wafer, reducing cost per die when yield is controlled.

• Thickness is about mechanical integrity and warpage control under thermal cycles. For backside thinning, bonding/debonding, and 3D integration, keeping TTV low improves uniformity in etch, deposition, and lithography. Ultra-flat silicon (< 1 µm TTV) narrows the process window and improves device parametric uniformity.

Plutosemi at a Glance

Plutosemi is a specialized manufacturer and wholesaler of semiconductor materials with three advanced production bases in China. The company lists monthly capacity of ~100,000 equivalent 6-inch silicon wafers and ~30,000 equivalent 8-inch Glass Wafers, giving buyers confidence in stable, scalable supply for both R&D and volume programs.

On the technology side, Plutosemi highlights:

• Ultra-thin & ultra-flat silicon capability (e.g., TTV ≤ 1 µm on ultra-flat options) for tighter CD and overlay budgets.

• Diverse silicon portfolio including ultra-thin, float-zone, low-resistance, doped (NTD), oxide, dummy/test wafers—covering line qualifications, pilot runs, and series production.

• Flexible MEMS micro-nano processing support and full-process services on glass/quartz substrates, aligning with hybrid integration trends.

What Wafer Sizes Does Plutosemi Support?

Plutosemi’s silicon offering spans mainstream diameters from 2–12 inches, with application-matched thickness and surface specs. Its related glass wafer lines (useful for carriers, capping, and packaging) are explicitly listed in 2, 3, 4, 5, 6, 8, and 12 inches, indicating fixture and process readiness across the same mechanical standards.

For customers scaling beyond baseline DSP polish, ultra-flat silicon is available to ≤ 1 µm TTV—a parameter that materially improves stepper focus/exposure control and post-CMP planarity.

Choosing the “Right Size” for Your Build

When teams ask “how big is a silicon wafer,” they usually mean “which diameter should we spec for the device and the fab flow?” A practical selection path looks like this:

1. Match foundry/tooling: Align wafer diameter with available carriers, aligners, furnaces, metrology, and CMP tools. If your pilot line is 150 mm but the target fab is 200 mm, plan for transfer protocols and mask sizing. Plutosemi supplies 150 mm and 200 mm formats with the corresponding thickness bands used in industry, streamlining trials and scale-up.

2. Balance cost vs. output: 300 mm boosts die count per wafer, but has higher minimum-order and mask ecosystem costs; 150–200 mm often win for power, MEMS, and analog where process maturity and device physics favor those nodes.

3. Engineer for flatness: If your stack is CMP- and litho-heavy, specify ultra-flat silicon (≤ 1 µm TTV) to tighten CD and overlay corners, reduce rework, and protect yield.

4. Plan for backside/advanced packaging: If you’ll thin wafers post-fabrication, ensure the incoming thickness leaves margin for grinding and handling. Typical 200 mm ~675–725 µm and 300 mm ~775–825 µm are proven starting points.

Surface, Flatness, and Metrology Options

Plutosemi supports DSP/SSP finishes, tight flatness, and surface roughness targets that underpin bonding, lithography, and TSV/through-glass via steps. Its glass wafer portfolio, often paired with silicon in process integration, documents Ra ≤ 1 nm, optional ultra-smooth Ra ≤ 0.2 nm, and scalable TTV controls—capabilities that reflect the metrology rigor applied on silicon lines as well.

Production Scale and Supply Assurance

A key differentiator for a wafer supplier is the combination of installed capacity and process breadth:

• Capacity: Three production bases; ~100k eq. 6-inch silicon wafers/month and ~30k eq. 8-inch glass wafers/month for dependable lead times.

• Breadth: Silicon (ultra-thin, float-zone, doped, oxide, dummy), plus glass/quartz substrates for carriers, capping, and packaging flows.

• Process support: Micro-nano processing services to accelerate fixturing and NPI steps, reducing time-to-first-yield for new devices.

Summary

Silicon wafer “size” is primarily its diameter, available in 2–12 inches, with 200 mm and 300 mm the most common in modern fabs. Thickness scales with diameter and can be tuned; flatness (TTV) is critical for lithography, bonding, and CMP-heavy flows. Plutosemi combines broad diameter coverage, ultra-flat wafer options (≤ 1 µm TTV), and meaningful monthly capacity across multiple production bases—making it a strong partner for R&D qualification through to sustained volume supply. If you’d like, I can tailor a wafer specification sheet for your program—target diameter, thickness band, resistivity, orientation, finish, and TTV—so your team can request a precise quotation and lead-time from Plutosemi.