Firstly, the smaller the values of these three parameters, the better. The larger the TTV, Bow, and Warp, the greater the negative impact on semiconductor manufacturing processes. Therefore, if the values of these three parameters exceed the standard, the Silicon Wafers will be scrapped.

Impact on the lithography process: Depth of focus issue: During the lithography process, it may cause changes in the depth of focus, thereby affecting the clarity of the pattern. Alignment issue: It may cause the wafer to shift during the alignment process, further affecting the alignment accuracy between layers.

Impact on chemical mechanical polishing: Uneven polishing: It may lead to uneven polishing during the CMP process, resulting in surface roughness and residual stress.

Impact on thin film deposition: Uneven deposition: Concave and convex wafers may cause uneven thickness of the deposited films during the deposition process.

Impact on wafer loading: Loading issue: Concave and convex wafers may cause wafer damage during the automatic loading process.